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NTGS3443B
Power MOSFET
-20 V, -4.2 A, Single P-Channel, TSOP-6
Features
? Low R DS(on) in TSOP-6 Package
? 2.5 V Gate Rating
? Fast Switching
? This is a Pb-Free Device
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment
? Li Ion Battery Linear Mode Charging
? High Side Load Switch
? HDD Switching Circuits, Camera Phone, etc.
V (BR)DSS
-20 V
http://onsemi.com
R DS(ON) MAX
60 m W @ -4.5 V
90 m W @ -2.7 V
100 m W @ -2.5 V
P-Channel
I D MAX
-3.7 A
-3.1 A
-3.0 A
1 2 5 6
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
V DSS
V GS
-20
$ 12
V
V
3
Continuous Drain
Current (Note 1)
Power Dissipation
Steady
State
t v 5s
Steady
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
-3.7
-2.7
-4.2
1.25
A
4
MARKING
DIAGRAM
(Note 1)
Continuous Drain
Current (Note 2)
State
t v 5s
Steady
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
1.6
-2.7
-2.0
W
A
1
TSOP-6
CASE 318G
STYLE 1
1
SB M G
G
Power Dissipation
(Note 2)
Pulsed Drain Current
State
t p = 10 m s
T A = 25 ° C
P D
I DM
0.7
-15
W
A
SB = Device Code
M = Date Code
G = Pb-Free Package
(Note: Microdot may be in either location)
Operating Junction and Storage Temperature
Lead Temperature for Soldering Purposes
T J ,
T STG
T L
-55 to
150
260
° C
° C
PIN ASSIGNMENT
Drain Drain Source
6 5 4
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq pad size.
1
2
3
(Cu area = 1.127 in sq [2 oz] including traces)
2. Surface-mounted on FR4 board using the minimum recommended pad size.
(Cu area = 0.0775 in sq)
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3443BT1G
Package
TSOP-6
Shipping ?
3000 / Tape & Reel
(Pb-Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 0
1
Publication Order Number:
NTGS3443B/D
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